Welcome!

Python Authors: Jyoti Bansal, Matt Davis, Pat Romanski, Donald Meyer, Liz McMillan

News Feed Item

COM Express Module With High Graphics Performance Supports Up to Four Displays

SAN BRUNO, CA -- (Marketwire) -- 12/17/12 -- MSC Embedded Inc., manufacturer of highly integrated standard board level products and customer-specific boards and systems, today introduced a powerful, new COM Express™ Type 6 module family. This family, called MSC C6C-A7, is based on the AMD embedded R-Series processors also known as accelerated processing units (APUs). MSC C6C-A7 members are compact form factor computer-on-modules characterized by very powerful graphics and high parallel computing performance with low power dissipation.

The MSC C6C-A7 module family integrates AMD R-460L 2.0 GHz (2.8 GHz Turbo) or AMD R-452L 1.6 GHz (2.4 GHz Turbo) quad-core processors. The thermal design power (TDP) levels are 25 W and 19 W, respectively. The two dual-core versions are populated with the AMD R-260H 2.1 GHz (2.6 GHz Turbo) processor or the AMD R-252F 1.7 GHz (2.3 GHz Turbo) processor -- each featuring 17 W TDP. The processors support the AMD64 technology and the AMD-V™ virtualization technology. The AMD Fusion Controller Hub (FCH) A75 chipset was also selected. The main memory can be expanded to 16 GB DDR3-1600 dual-channel SDRAM via two SO DIMM sockets.

The Radeon HD7000G-Series graphics engine integrated into the AMD R-Series APU, with its excellent graphics capabilities, offers support for DirectX 11, OpenGL 4.2 and OpenCL 1.1. The modules support up to four independent displays via DisplayPort 1.2 or HDMI, MPEG-2 decoding, H.264 and VCE (video compression engine). Thanks to this module family's high computing and graphics performance, the platform is especially suited for demanding applications with 3D graphics or high-definition videos and for the control of large displays such as in those found in medical technology as well as in the fields of infotainment, digital signage and gaming.

With Type 6 pinouts, the COM Express module family offers six PCI Express™ x 1 channels and a PCI Express graphics (PEG) x 8 interface. In addition, all modules feature four USB 3.0 and four USB 2.0 ports, LPC, Gbit Ethernet, and HD audio. In addition, up to four SATA interfaces at up to 300 MB/s are available. With DisplayPort and HDMI interfaces (3x digital display interface) with resolutions of up to 4096 x 2160 (DP) and 1920 x 1200 (HDMI), along with LCD and VGA interfaces, the MSC C6C-A7 modules offer comprehensive display support.

The high-performance platform MSC C6C-A7 runs under the Microsoft Windows® Embedded Standard 7 operating system, as well as Linux. The UEFI firmware from AMI is used as BIOS. In addition to the embedded modules, MSC offers a corresponding Starter Kit and carrier boards, as well as cooling solutions and memory modules.

Pricing and Availability
Product samples will be available by end of January. The cost-optimized module is around US $290.00 in volume orders.

MSC Embedded Inc.
MSC Embedded Inc. is a manufacturer of board-level products and customer specific industrial embedded computers. Products include COM Express ™, Qseven and ETX ® as well as products that interface to COM modules like carrier boards, I/O technologies for displays or other process interfaces. MSC Embedded also offers custom BIOS adaptation, BSP and device drivers for all its products to OEM customers worldwide. The company's headquarters is based in San Bruno, CA and Stutensee, Germany. For more information, visit www.mscembedded.com

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2184067

Press Contacts:

Michael Miller
Direct: (650) 616 4068
Fax: (650) 616 4001
Email: Email Contact
www.mscembedded.com

Andrea Vedanayagam
Veda Communications
(408) 656-4494
Email Contact

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

@ThingsExpo Stories
China Unicom exhibit at the 19th International Cloud Expo, which took place at the Santa Clara Convention Center in Santa Clara, CA, in November 2016. China United Network Communications Group Co. Ltd ("China Unicom") was officially established in 2009 on the basis of the merger of former China Netcom and former China Unicom. China Unicom mainly operates a full range of telecommunications services including mobile broadband (GSM, WCDMA, LTE FDD, TD-LTE), fixed-line broadband, ICT, data communica...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex softw...
SYS-CON Events announced today that Cloud Academy will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloud Academy is the industry’s most innovative, vendor-neutral cloud technology training platform. Cloud Academy provides continuous learning solutions for individuals and enterprise teams for Amazon Web Services, Microsoft Azure, Google Cloud Platform, and the most popular cloud computing technologies. Ge...
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
"My role is working with customers, helping them go through this digital transformation. I spend a lot of time talking to banks, big industries, manufacturers working through how they are integrating and transforming their IT platforms and moving them forward," explained William Morrish, General Manager Product Sales at Interoute, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
With billions of sensors deployed worldwide, the amount of machine-generated data will soon exceed what our networks can handle. But consumers and businesses will expect seamless experiences and real-time responsiveness. What does this mean for IoT devices and the infrastructure that supports them? More of the data will need to be handled at - or closer to - the devices themselves.
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
My team embarked on building a data lake for our sales and marketing data to better understand customer journeys. This required building a hybrid data pipeline to connect our cloud CRM with the new Hadoop Data Lake. One challenge is that IT was not in a position to provide support until we proved value and marketing did not have the experience, so we embarked on the journey ourselves within the product marketing team for our line of business within Progress. In his session at @BigDataExpo, Sum...
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
SYS-CON Events announced today that Telecom Reseller has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Addteq will exhibit at SYS-CON's DevOps Summit at Cloud Expo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Addteq specializes in creating innovative solutions to solve business processes through the use of DevOps automation. Addteq was founded on the firm belief that automation is essential for successful software releases. Addteq's products and services are centered around the fundamental approach of understanding the pr...
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
"I think that everyone recognizes that for IoT to really realize its full potential and value that it is about creating ecosystems and marketplaces and that no single vendor is able to support what is required," explained Esmeralda Swartz, VP, Marketing Enterprise and Cloud at Ericsson, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
The buzz continues for cloud, data analytics and the Internet of Things (IoT) and their collective impact across all industries. But a new conversation is emerging - how do companies use industry disruption and technology enablers to lead in markets undergoing change, uncertainty and ambiguity? Organizations of all sizes need to evolve and transform, often under massive pressure, as industry lines blur and merge and traditional business models are assaulted and turned upside down. In this new da...