Welcome!

Python Authors: AppDynamics Blog, Liz McMillan, Pat Romanski, Donald Meyer, Elizabeth White

News Feed Item

PHYTEC announces the phyCORE®-OMAP5430 processor-based System-on-Module

The phyCORE®-OMAP5430 SOM speeds design efforts and offers a tremendous opportunities for embedded designers that require high performance with high power efficiency.

MUNICH, Germany, Nov. 12, 2012 /PRNewswire/ -- PHYTEC announces the phyCORE-OMAP5430 System on Module (SOM), a feature-packed SOM based on the OMAP5430 processor from Texas Instruments Incorporated (TI). In 2011 PHYTEC released the first SOM to the market supporting TI's OMAP4 platform. Now customers have a perfect migration path with pin compatibility to the OMAP 5 platform.

The OMAP5430 processor is an advanced architecture which includes a dual-core ARM® Cortex-A15 MPCore foundation, complemented by multiple graphics accelerators and dual Cortex-M4 cores for low-power offload and real-time responsiveness. Multi-core POWERVR™ SGX544-MPx graphics accelerators drive 3D gaming and 3D user interfaces on the processor, while other features include: a dedicated 2D graphics engine, hardware accelerators for full HD 1080p60fps and 1080p30fps 3D, support of simultaneous cameras and displays, and high performance peripheral interfaces.

PHYTEC production-ready SOM technology, combined with operating system board support packages, provides a critical foundation so embedded designers do not have to develop their application from the ground up. Designing in a SOM reduces the complexity and scope of product developments, allowing OEMs to significantly reduce cost, time-to-market and design risk. The phyCORE-OMAP5430 provides a perfect balance of power efficiency and high performance and is well suited for deployment in markets with high-end, feature-intensive products leveraging wireless embedded applications for industrial, medical and video or imaging solutions. 

Highlights for the phyCORE-OMAP5430 SOM include:

  • OMAP5430 processor
  • up to 4 GB LPDDR2 RAM
  • up to 64 GB eMMC Flash
  • Memory expansion: 2x SDIO/MMC
  • Networking: 10/100 Mbit/s Ethernet
  • Other I/O: 1x USB 3.0, 1x USB 2.0, 4x UARTS (one RS-232), 3x I2C, 1x 1-Wire, 1x MCBSP, 2x MCSPI
  • Display: 1x Display Serial Interface (DSI), 1x Display Parallel Interface, 1x HDMI
  • Power : 3.3V supply, 1.8V I/O
  • Operating temperature: -40°C to +85°C
  • Dimensions: 55 x 45 mm
  • Planned Operating System Support: Linux, Windows, and Android

The phyCORE-OMAP5430 will be available in a PHYTEC Rapid Development Kit (RDK).  The kit includes the SOM, carrier board, board support package (BSP), demo images and all contents required for immediate start-up.  The carrier board serves as a starting point for design of target hardware.  The RDK provides an immediate platform on which to develop application code that can be seamlessly integrated along with the SOM into prototype, pre-production, and production systems.  OEMs with aggressive timelines or limited resources can employ PHYTEC's full range of design services that include: embedded hardware design; Linux, Windows Embedded and Android adaptation; and complete turnkey designs.

Michael Mitezki, Chief Executive Officer of PHYTEC, said "PHYTEC has evolved a clear and rich roadmap with our partners. Having early access to cutting edge silicon before the general market, we are able to support many OEMs who cannot access this technology directly. The phyCORE-OMAP5430 is an exciting addition to PHYTEC's product line of System on Modules based on TI's applications processors.

"With a history of working with previous-generation OMAP processors, the PHYTEC team has an astute ability to leverage the best of the OMAP processor architecture for embedded applications," said Michael Schoonover, industrial business development manager, OMAP platform business unit, TI. "The new OMAP 5 processor-based phyCORE-OMAP5430 SoM provides a feature-packed option for embedded developers, backed by PHYTEC's commitment to maximize investments and fuel solid design execution."

Availability

phyCORE-OMAP5430 Rapid Development Kits will be available to PHYTEC Alpha customers in Q1/2013. Please contact PHYTEC for more information at [email protected]from North America, or [email protected] for all other locations.

About PHYTEC

PHYTEC is an end-to-end solution to OEMs through all stages of product development, from initial concept and specification, to design and development, to prototype, launch, and full production. We offer systems integration support with hardware and software design services, Windows Embedded, Linux, and Android expertise, System on Modules, development kits, and manufacturing facilities. Headquartered in Mainz, Germany, PHYTEC remains a privately-held enterprise with operational subsidiaries in North America, France, and India. PHYTEC products have been deployed in thousands of embedded designs, ranging from industrial control, to medical, automotive, avionic and data processing applications.

For more information about PHYTEC, visit www.phytec.com.

About the Texas Instruments Design Network

PHYTEC is a member of the TI Design Network, a premier group of independent, well-established companies that offer products and system-level design and manufacturing services complementing TI's semiconductors to a worldwide customer base to accelerate product innovation and time-to-market. Network members provide product design, hardware and software system integration, turnkey product design, RF and processor system modules, reference platforms, software development, proof-of-concept design, feasibility studies, research, certification compliance, prototyping, manufacturing, and product life cycle management.

For more information about the TI Design Network, please visit http://www.ti.com/designnetwork .

© 2012 PHYTEC. All Rights Reserved.  phyCORE® is a registered trademark of the PHYTEC Technologie Holding AG and PHYTEC America LLC. All other brands or product names are the property of their respective holders. 

SOURCE PHYTEC America

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management solutions, helping companies worldwide activate their data to drive more value and business insight and to transform moder...
Fifty billion connected devices and still no winning protocols standards. HTTP, WebSockets, MQTT, and CoAP seem to be leading in the IoT protocol race at the moment but many more protocols are getting introduced on a regular basis. Each protocol has its pros and cons depending on the nature of the communications. Does there really need to be only one protocol to rule them all? Of course not. In his session at @ThingsExpo, Chris Matthieu, co-founder and CTO of Octoblu, walk you through how Oct...
The Internet of Things can drive efficiency for airlines and airports. In their session at @ThingsExpo, Shyam Varan Nath, Principal Architect with GE, and Sudip Majumder, senior director of development at Oracle, will discuss the technical details of the connected airline baggage and related social media solutions. These IoT applications will enhance travelers' journey experience and drive efficiency for the airlines and the airports. The session will include a working demo and a technical d...
There is little doubt that Big Data solutions will have an increasing role in the Enterprise IT mainstream over time. Big Data at Cloud Expo - to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA - has announced its Call for Papers is open. Cloud computing is being adopted in one form or another by 94% of enterprises today. Tens of billions of new devices are being connected to The Internet of Things. And Big Data is driving this bus. An exponential increase is...
Digital innovation is the next big wave of business transformation based on digital technologies of which IoT and Big Data are key components, For example: Business boundary innovation is a challenge to excavate third-party business value using IoT and BigData, like Nest Business structure innovation may propose re-building business structure from scratch, as Uber does in the taxicab industry The social model innovation is also a big challenge to the new social architecture with the design fr...
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, provided an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life sett...
The many IoT deployments around the world are busy integrating smart devices and sensors into their enterprise IT infrastructures. Yet all of this technology – and there are an amazing number of choices – is of no use without the software to gather, communicate, and analyze the new data flows. Without software, there is no IT. In this power panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, panelists will look at the protocols that communicate data and the emerging data analy...
SYS-CON Events announced today that China Unicom will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. China United Network Communications Group Co. Ltd ("China Unicom") was officially established in 2009 on the basis of the merger of former China Netcom and former China Unicom. China Unicom mainly operates a full range of telecommunications services including mobile broadband (GSM, WCDMA, LTE F...
DevOps at Cloud Expo, taking place Nov 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 19th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long dev...
Data is an unusual currency; it is not restricted by the same transactional limitations as money or people. In fact, the more that you leverage your data across multiple business use cases, the more valuable it becomes to the organization. And the same can be said about the organization’s analytics. In his session at 19th Cloud Expo, Bill Schmarzo, CTO for the Big Data Practice at EMC, will introduce a methodology for capturing, enriching and sharing data (and analytics) across the organizati...
SYS-CON Events announced today that ReadyTalk, a leading provider of online conferencing and webinar services, has been named Vendor Presentation Sponsor at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. ReadyTalk delivers audio and web conferencing services that inspire collaboration and enable the Future of Work for today’s increasingly digital and mobile workforce. By combining intuitive, innovative tec...
The Transparent Cloud-computing Consortium (abbreviation: T-Cloud Consortium) will conduct research activities into changes in the computing model as a result of collaboration between "device" and "cloud" and the creation of new value and markets through organic data processing High speed and high quality networks, and dramatic improvements in computer processing capabilities, have greatly changed the nature of applications and made the storing and processing of data on the network commonplace.
SYS-CON Events announced today the Enterprise IoT Bootcamp, being held November 1-2, 2016, in conjunction with 19th Cloud Expo | @ThingsExpo at the Santa Clara Convention Center in Santa Clara, CA. Combined with real-world scenarios and use cases, the Enterprise IoT Bootcamp is not just based on presentations but with hands-on demos and detailed walkthroughs. We will introduce you to a variety of real world use cases prototyped using Arduino, Raspberry Pi, BeagleBone, Spark, and Intel Edison. Y...
Major trends and emerging technologies – from virtual reality and IoT, to Big Data and algorithms – are helping organizations innovate in the digital era. However, to create real business value, IT must think beyond the ‘what’ of digital transformation to the ‘how’ to harness emerging trends, innovation and disruption. Architecture is the key that underpins and ties all these efforts together. In the digital age, it’s important to invest in architecture, extend the enterprise footprint to the cl...
Video experiences should be unique and exciting! But that doesn’t mean you need to patch all the pieces yourself. Users demand rich and engaging experiences and new ways to connect with you. But creating robust video applications at scale can be complicated, time-consuming and expensive. In his session at @ThingsExpo, Zohar Babin, Vice President of Platform, Ecosystem and Community at Kaltura, will discuss how VPaaS enables you to move fast, creating scalable video experiences that reach your...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
Big Data has been changing the world. IoT fuels the further transformation recently. How are Big Data and IoT related? In his session at @BigDataExpo, Tony Shan, a renowned visionary and thought leader, will explore the interplay of Big Data and IoT. He will anatomize Big Data and IoT separately in terms of what, which, why, where, when, who, how and how much. He will then analyze the relationship between IoT and Big Data, specifically the drilldown of how the 4Vs of Big Data (Volume, Variety,...
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
WebRTC adoption has generated a wave of creative uses of communications and collaboration through websites, sales apps, customer care and business applications. As WebRTC has become more mainstream it has evolved to use cases beyond the original peer-to-peer case, which has led to a repeating requirement for interoperability with existing infrastructures. In his session at @ThingsExpo, Graham Holt, Executive Vice President of Daitan Group, will cover implementation examples that have enabled ea...